Electrical connectivity of die to a host substrate

ABSTRACT

According to example configurations herein, an apparatus comprises a die and a host substrate. The die can include a first transistor and a second transistor. A surface of the die includes multiple conductive elements disposed thereon. The multiple conductive elements on the surface are electrically coupled to respective nodes of the first transistor and the second transistor. Prior to assembly, the first transistor and second transistor are electrically isolated from each other. During assembly, the surface of the die including the respective conductive elements is mounted on a facing of the host substrate. Accordingly, a die including multiple independent transistors can be flipped and mounted to a respective host substrate such as printed circuit board, lead frame, etc.

RELATED APPLICATIONS

This application is a continuation of earlier filed U.S. patentapplication Ser. No. 14/175,378 entitled “ELECTRICAL CONNECTIVITY OF DIETO A HOST SUBSTRATE,”, filed on Feb. 7, 2014, the entire teachings ofwhich are incorporated herein by this reference.

U.S. patent application Ser. No. 14/175,378 is a continuation-in-part ofearlier filed U.S. patent application Ser. No. 12/505,989 entitled“ELECTRICAL CONNECTIVITY FOR CIRCUIT APPLICATIONS,”, filed on Jul. 20,2009, the entire teachings of which are incorporated herein by thisreference.

U.S. patent application Ser. No. 12/505,989 is related to and claims thebenefit of earlier filed U.S. Provisional Patent Application Ser. No.61/148,292 entitled “Modular Buck Power Chip and ConnectivityTechniques,”, filed on Jan. 29, 2009, the entire teachings of which areincorporated herein by this reference.

U.S. patent application Ser. No. 12/505,989 is related to and claims thebenefit of earlier filed U.S. Provisional Patent Application Ser. No.61/166,149 entitled “Electrical Connectivity for Circuit Applications,”,filed on Apr. 2, 2009, the entire teachings of which are incorporatedherein by this reference.

BACKGROUND

Surface-mount technology (SMT) provides a way of interconnectingelectronic circuit components with each other. For example, according tosuch technology, electronic devices are specifically packaged formounting directly on a respective surface of a printed circuit board.Because of the advantages associated with surface mount technology suchas smaller part size, surface mount technology has, to a large extent,replaced through-hole technology in which wire leads of components arefitted and soldered into holes of a printed circuit board to provideconnectivity.

Surface mount devices come in a variety of styles. For example, asurface mount device can have relatively small leads or no leads at all.Because a surface mount device has relatively small leads or no leads atall, a surface mount device is usually smaller than its through-holecounterpart. The surface mount device may have short pins or leads ofvarious styles, flat contacts, a matrix of solder balls (such as BallGrid Arrays), or terminations on the body of the component.

One type of electronic circuit that can be packaged in a surface mountdevice is an integrated circuit or semiconductor chip. The integratedcircuit can provide a variety of functionality depending on how theintegrated circuit (e.g., chip) is designed. For example, in a specificapplication, an integrated circuit can include one or more arrays ofsmall transistors that are interconnected in parallel with respect toeach other based solely on metal layers (e.g., conductive paths) in theintegrated circuit. Connecting multiple small transistors of anintegrated circuit in parallel via the corresponding layers of metaleffectively produces a single transistor supporting high current driveand low impedance switching capability.

In certain applications, transistors can be obtained as discretecomponents and connected in parallel with each other via respectivetraces on a circuit board. As is the case for multiple transistorsconnected in parallel via the metal layers in an integrated circuit, theparallel transistors on a circuit board provide higher sinking andsourcing capability.

BRIEF DESCRIPTION

Conventional applications such as those as discussed above can sufferfrom a number of deficiencies. For example, a conventional switchcircuit derived from an array of small transistors in an integratedcircuit can require tens, hundreds, or even more transistors connectedin parallel via metal in the integrated circuit to produce a singleeffective, functional transistor. Connecting multiple transistors inparallel can be quite complex due to the number of individualtransistors that must be interconnected. For example, each transistor inthe array can have a corresponding gate, source, and drain. To connectthe transistors in parallel and form a single effective transistordevice, the integrated circuit must connect all of the gates to eachother, all of the sources to each other, and all of the drains to eachother. Providing connectivity requires a complex metal interconnectpotentially including many layers.

As is known, the transistors in the device as well as correspondingmetal interconnect layers of the integrated circuit are very small andthus difficult and expensive to manufacture. Even if it is possible tomanufacture such devices, the complexity of the metal interconnectlayers of the integrated circuit means that the device is more likelyprone to failure or low manufacture yields. Additionally, when used, themetalization layers in an integrated circuit are usually not thickenough to provide a very low impedance path.

Embodiments herein deviate with respect to the conventional applicationsas discussed above. For example, embodiments herein are directed to aunique way of providing interconnectivity of circuitry such astransistors in an integrated circuit device.

More specifically, one embodiment herein includes a leadframe comprisinga first connection interface. The first connection interface can beconfigured for attaching an electrical circuit to the leadframe. Theleadframe also can include a conductive path. The conductive path in theleadframe provides an electrical connection between a first electricalnode of the electrical circuit and a second electrical node of theelectrical circuit. Prior to making the connection between theelectrical circuit and the leadframe, the first electrical node and thesecond electrical node are electrically isolated from each other.Subsequent to making connection of the electrical circuit with theleadframe, the conductive path of the leadframe electrically connectsthe first electrical node and the second electrical node together.Accordingly, embodiments herein include a way of utilizing a leadframeto provide connectivity between nodes of an electrical circuit in lieuof having to provide such connectivity at, for example, an on-chip metalinterconnect layer of an integrated circuit device.

The leadframe can also include a second connection interface forattaching the leadframe to a host substrate such as a circuit board. Thesecond connection interface of the leadframe can include one or morecontact elements for electrically coupling the conductive path of theleadframe to the substrate.

Although any reasonable configuration is possible, according to oneembodiment, the first connection interface resides on a first facing ofthe leadframe and the second connectivity interface resides on a secondfacing of the leadframe. The first facing and the second facing of theleadframe can be disposed on opposite sides of the leadframe withrespect to each other, adjacent sides of the leadframe, same side of theleadframe, etc.

According to another embodiment, a system includes an electronic circuitdevice, a circuit board substrate, and a leadframe in which to packagethe electronic circuit device. The leadframe includes a first facing.The first facing of the leadframe can be configured for attaching theelectrical circuit to the leadframe. The leadframe can also include aconductive path. The conductive path in the leadframe provides anelectrical connection between a first electrical node of the electroniccircuit device and a second electrical node of the electronic circuitdevice. Prior to being connected to the leadframe, the first electricalnode and the second electrical node of the electrical circuit areinitially electrically isolated from each other. Subsequent toconnecting the electrical circuit to the leadframe, the conductive pathin the leadframe provides an electrical connection between the firstelectrical node and the second electrical node of the electricalcircuit.

In one embodiment, the leadframe includes a second facing to complementthe first facing. The second facing of the leadframe includes at leastone contact element for electrically coupling the conductive path of theleadframe to the circuit board substrate. In such an embodiment, thefirst electrical node and the second electrical node can be electricallycoupled to the circuit board substrate via the conductive paths in theleadframe.

In yet another embodiment, a leadframe device comprises a first facing,a second facing, and a conductive path from the first facing and thesecond facing. The conductive path has a contact region on the firstfacing. The conductive path also has a contact region on the secondfacing. Via coupling of the switch circuits to the contact region on thefirst facing, the conductive path provides electrical coupling ofmultiple electrically isolated switch circuits to each other. Asmentioned above, via coupling of the substrate to the contact region onthe second facing, the conductive path through the leadframe deviceprovides coupling of the multiple switch circuits to a circuitsubstrate.

In still further embodiments, an integrated circuit device comprises afirst switch circuit and a second switch circuit. The first switchcircuit includes a first set of switches connected in parallel with eachother. The first switch circuit also includes an electrical node forconnecting the first switch circuit to a first contact in a leadframedevice. The second switch circuit includes a second set of switchesconnected in parallel with each other. The second switch circuit alsoincludes an electrical node for connecting the second switch circuit toa second contact of the leadframe device. The electrical node of thefirst switch circuit is at least initially electrically isolated fromthe electrical node of the second switch circuit. As described herein,the leadframe device can include a conductive path for electricallycoupling the first contact and the second contact. More specifically, aconnection of the electrical node in the first switch circuit to thefirst contact of the leadframe device and a connection of the electricalnode in the second switch circuit to the second contact of the leadframedevice electrically couples the electrical node in the first switchcircuit to the electrical node in the second switch circuit.

Embodiments herein further include methods of using a leadframe toprovide connectivity. For example, one embodiment herein includesreceiving an integrated circuit and a leadframe device in which topackage the integrated circuit. The integrated circuit such as asemiconductor device or semiconductor chip has multiple electricallyisolated switch circuits or switch circuit nodes disposed thereon. Insuch an embodiment, electrical coupling of the integrated circuit to afacing of the leadframe device provides connectivity between themultiple electrically isolated switch circuits or switch circuit nodesvia at least one conductive path in the leadframe device.

Yet further embodiments include an apparatus. The apparatus includes adie. The die comprises: a first transistor and a second transistor. Asurface of the die includes multiple conductive elements disposedthereon. The multiple conductive elements on the surface of the die areelectrically coupled to respective nodes of the first transistor and thesecond transistor. In one embodiment, the apparatus further includes ahost substrate. The surface of the die including the respectiveconductive elements is mounted on a facing of the host substrate.Accordingly, a die including multiple transistors can be flipped andmounted onto a respective host substrate such as printed circuit board,lead frame, etc.

This example embodiment can be implemented along with any of one or moreof the following features to produce yet further embodiments below:

For example, in one embodiment, the surface of the die is mounteddirectly on the host substrate.

In accordance with another embodiment, the surface of the die isdirectly coupled to an electronic circuit package. The electroniccircuit package can be mounted to the host substrate. The electroniccircuit package provides connectivity between the respective nodes andthe facing of the host substrate.

In still further embodiments, the first transistor is electricallyisolated from the second transistor prior to mounting of the die to thefacing of the host substrate. At least one conductive path disposed onthe host substrate provides electrical connectivity between the firsttransistor and the second transistor.

The first transistor can be configured to include a gate node, a sourcenode, and a drain node. The second transistor also can be configured toinclude a gate node, a source node, and a drain node.

In yet further embodiments, the first transistor can be a control switchof a switching power supply circuitry. The second transistor can be asynchronous switch in the switching power supply circuitry. In oneembodiment, the host substrate provides an electrical connection betweenthe source node of the first transistor and the drain node of the secondtransistor.

In accordance with further embodiments, the apparatus can include aninductor element. The first node of the inductor element can beelectrically connected to the source node of the first transistor andthe drain node of the second transistor. The apparatus can furtherinclude a controller. The controller can be configured to receivefeedback of an output voltage produced at a second node of the inductor.In one embodiment, the controller drives the gate node of the firsttransistor and the gate node of the second transistor to produce theoutput voltage within a desired range.

In yet further embodiments, the host substrate electrically connects aninput voltage to the source node of the first transistor.

In another embodiment, the first transistor is electrically coupled tothe second transistor via a conductive path disposed in the die.

The die can be configured to include a controller, nodes of thecontroller electrically coupled to conductive paths on the hostsubstrate. The controller can be configured to control operationalstates of the first transistor and the second transistor via controlsignals transmitted over the conductive paths.

In yet further embodiments, the first transistor is a first singlelateral field effect transistor disposed in the die. The secondtransistor is a second single lateral field effect transistor disposedin the die.

Yet additional further embodiments include a method. The methodincludes: receiving a die and mounting a surface of the die to a facingof a host substrate. The die can be configured to include a firsttransistor and a second transistor. The surface of the die includesmultiple conductive elements thereon. Subsequent to mounting, themultiple conductive elements on the surface can be electrically coupledto respective nodes of the first transistor and the second transistor.

This example method embodiment can be implemented along with any of oneor more of the following features to produce yet further embodimentsbelow:

For example, in one embodiment, the method further comprises mountingthe surface of the die directly onto the host substrate.

In yet further embodiments, the surface of the die can be directlycoupled to an electronic circuit package. The method embodiments canfurther include: mounting the electronic circuit package to the hostsubstrate. In such an instance, the host substrate provides connectivitybetween the respective nodes and the facing of the host substrate.

In another embodiment, the first transistor is electrically isolatedfrom the second transistor prior to mounting of the die to the facing ofthe host substrate. The method can further include: mounting the die tothe facing of the host substrate to provide electrical connectivitybetween the first transistor and the second transistor via at least oneconductive path disposed on the host substrate.

In yet a further method embodiment, the first transistor is a controlswitch of a switching power supply circuit. The second transistor is asynchronous switch in the switching power supply circuitry. The methodfurther comprises: via a first conductive path in the host substrate,providing an electrical connection between a source node of the firsttransistor and the drain node of the second transistor; and via a secondconductive path in the host substrate, electrically connecting an inputvoltage to a source node of the first transistor.

In accordance with another embodiment, the method can includeelectrically connecting both the source node of the first transistor andthe drain node of the second transistor to a first node of an inductorelement; and electrically connecting a controller to a gate node of thefirst transistor and a gate node of the second transistor. Thecontroller can be configured to produce an output voltage at a secondnode of the inductor to be within a desired range.

In still further embodiments, the die can include a controller circuit.The method further comprises: via conductive paths in the hostsubstrate, electrically coupling the respective nodes of the die to thecontroller. The controller can be configured to control operationalstates of the first transistor and the second transistor via controlsignals transmitted over the conductive paths.

These and other more specific embodiments are disclosed in more detailbelow.

The embodiments as described herein are advantageous over conventionaltechniques. For example, the leadframe device according to embodimentsherein can provide unique connectivity, alleviating the complexity ofhaving to provide connections at a metal interface of an integratedcircuit device.

It is to be understood that the system, method, apparatus, etc., asdiscussed herein can be embodied strictly as hardware, as a hybrid ofsoftware and hardware, or as software alone such as within a processor,or within an operating system or a within a software application.Example embodiments of the invention may be implemented within productsand/or software applications such as those developed or manufactured byCHiL Semiconductor of Tewksbury, Mass., USA.

As discussed above, techniques herein are well suited for use inleadframe packaging applications. However, it should be noted thatembodiments herein are not limited to use in such applications and thatthe techniques discussed herein are well suited for other applicationsas well.

Additionally, note that although each of the different features,techniques, configurations, etc., herein may be discussed in differentplaces of this disclosure, it is intended, where appropriate, that eachof the concepts can optionally be executed independently of each otheror in combination with each other. Accordingly, the one or more presentinventions as described herein can be embodied and viewed in manydifferent ways.

Also, note that this preliminary discussion of embodiments hereinpurposefully does not specify every embodiment and/or incrementallynovel aspect of the present disclosure or claimed invention(s). Instead,this brief description only presents general embodiments andcorresponding points of novelty over conventional techniques. Foradditional details and/or possible perspectives (permutations) of theinvention(s), the reader is directed to the Detailed Description sectionand corresponding figures of the present disclosure as further discussedbelow.

For example, as further discussed below, embodiments herein support: 1)scalability by adding or deleting rows and columns of transistor arraymodule to produce larger and smaller circuit devices 2) use ofconductive paths in a leadframe device to provide current pathinterconnects between transistor modules to enable the use of thick toplayer metal (in parallel with other layers of a semiconductor device)for control purposes, a low impedance gate interconnect as describedherein enables a centralized driver circuit which simplifies a leadframedesign, further enhancing scalability; and 3) size matching of chiptransistor modules with respect to a leadframe strip pitch in aleadframe device.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features, and advantages of theinvention will be apparent from the following more particulardescription of preferred embodiments herein, as illustrated in theaccompanying drawings in which like reference characters refer to thesame parts throughout the different views. The drawings are notnecessarily to scale, with emphasis instead being placed uponillustrating the embodiments, principles, concepts, etc.

FIG. 1 is an example side view diagram of a leadframe package accordingto embodiments herein.

FIG. 2 is an example 3-D diagram illustrating coupling of an electricalcircuit to a corresponding leadframe according to embodiments herein.

FIG. 3 is an example example 3-D diagram illustrating coupling of anelectrical circuit to a corresponding leadframe according to embodimentsherein.

FIG. 4A is an example diagram of an electrical circuit of multipleelectrically individual tiles of transistors according to embodimentsherein.

FIG. 4B is an example diagram of electrical circuits on a waferaccording to embodiments herein.

FIG. 5 is an example diagram of a tile including an array of multipleinterconnected transistors according to embodiments herein.

FIG. 6 is an example diagram illustrating connectivity between eachtransistor tile circuit and a respective conductive path in theleadframe according to embodiments herein.

FIG. 7 is an example diagram illustrating an array of interconnectedtransistors according to embodiments herein.

FIG. 8 is an example diagram of a footprint associated with a leadframepackage according to embodiments herein.

FIG. 9 is an example see-through diagram illustrating connectivity froman electrical circuit, through a leadframe package, to a substrateaccording to embodiments herein.

FIG. 10 is a flowchart illustrating an example method supportinggeneration of a package including a leadframe and an electrical circuitaccording to embodiments herein.

FIG. 11 is an example example 3-D diagram illustrating coupling of aelectrical circuits to a corresponding leadframe according toembodiments herein.

FIG. 12 is a diagram illustrating functionality provided by an exampleleadframe device and related components according to embodiments herein.

FIG. 13 is a diagram illustrating packaging of components in an exampleleadframe device according to embodiments herein.

FIG. 14 is an example perspective view illustrating a die includingmultiple transistors according to embodiments herein.

FIG. 15A is an example diagram illustrating a side view of a dieaccording to embodiments herein.

FIG. 15B is an example diagram illustrating a side view of a dieaccording to embodiments herein.

FIG. 16 is an example diagram illustrating mounting of a die onto arespective host substrate according to embodiments herein.

FIG. 17 is a side view diagram illustrating connectivity of nodes in adie according to embodiments herein.

FIG. 18 is an example perspective diagram illustrating a die includingmultiple transistors and additional circuitry according to embodimentsherein.

FIG. 19 is an example diagram illustrating a method flowchartillustrating assembly of a power supply circuit according to embodimentsherein.

DETAILED DESCRIPTION

FIG. 1 is an example diagram illustrating interconnectivity of anelectrical circuit 120, leadframe device 190, and substrate 170according to embodiments herein.

As shown, one embodiment herein includes a leadframe device 190comprising a connection interface 110-1. The connection interface 110-1can be configured for electrically attaching an electrical circuit 120to the leadframe device 190.

The leadframe device 190 includes a conductive path 140-1. Theconductive path 140-1 has a contact region on facing 150-1 in theleadframe device 190 and provides an electrical connection betweenelectrical node 125-1 of the electrical circuit 120 and electrical node125-2 of the electrical circuit 120.

Prior to making the connection between the electrical circuit 120 andthe contact region of the conductive path 140 in the leadframe device190, the electrical node 125-2 and the electrical node 125-1 areelectrically isolated from each other. In other words, they are notelectrically connected with respect to each other by virtue of a metalinterconnect on the electrical circuit 120.

Subsequent to making connection of the electrical circuit 120 with theleadframe device 190 via conductive bridge elements 130, the conductivepath 140-1 of the leadframe device 190 electrically connects theelectrical node 125-2 and the electrical node 125-1 together.

In one embodiment, the conductive bridge element 130-1 electricallyconnects the electrical node 125-1 to the conductive path 140-1. Theconductive bridge element 130-2 electrically connects the electricalnode 125-2 to the conductive path 140-1.

The conductive bridge element 130 can take on any of a number ofdifferent forms. For example, in one embodiment, the conductive bridgeelement 130 is a pillar made of conductive material.

The pillar or other suitably shaped bridge can be formed on a surface ofthe electrical circuit 120 by depositing a metal layer on the electricalcircuit 120 and then etching away a portion of the deposited metal layerto produce, for example, one or more pillars. In one embodiment, thepillars are plated up after a mask is applied. This is a selectiveplating process as opposed to a selective etching. Either approach couldbe used.

A conductive material such as solder can be used to connect the pillar(conductive bridge element) to the conductive path 140-2. In oneembodiment, the conductive bridge elements 130 are made from copper,although any suitable metal can be used to provide such functionality.

Thus, in an example embodiment, the electrical node 125-1 can beelectrically coupled to a pillar of conductive material for connecting afirst portion of the electrical circuit 120 to the conductive path 140-1of the leadframe device 190. The electrical node 125-2 can beelectrically connected to a second pillar of conductive material forconnecting a second portion of the electrical circuit 120 to theconductive path 140-1 of the leadframe device 190. Again, the conductivebridge elements 130 can be made of copper or other suitable material.

According to other alternative embodiments, note that the conductivebridge elements 130 can be solder balls that connect respectiveelectrical nodes 125 of the electrical circuit 120 to the conductivepath 140-1. As mentioned, any suitable conductive material can be usedto provide connectivity between the electrical nodes 125 and theconductive path 140-1.

Note that in an example embodiment the electrical circuit 120 is anintegrated circuit such as a semiconductor chip. The electrical nodes125 can emanate from a single electrical circuit 120 fabricated on acommon semiconductor substrate. The electrical circuit 120 can thus be asemiconductor chip cut from a wafer.

In alternative embodiments, the electrical circuit 120 can include anumber of semiconductor chips that are packaged into the same leadframepackage 100.

Accordingly, embodiments herein include a way of utilizing a leadframedevice 190 to provide off-chip connectivity between electrical nodes 125of an electrical circuit 120 in lieu of having to provide suchconnectivity at, for example, a metal interconnect layer of theintegrated circuit device.

As shown, the leadframe device 190 can also include a second connectioninterface 110-1 for attaching the leadframe device 190 to a substrate170 such as a printed circuit board, flex-board, etc. Conductive bridgeelements 160 such as conductive bridge element 160-1, conductive bridgeelement 160-2, conductive bridge element 160-3, and conductive bridgeelement 160-4 can provide electrical connectivity between the contactelements 145 and a respective one or more traces of the substrate 170.In one embodiment, each of the contact elements 145 is a conductivesurface pad of the leadframe device 190 that is electrically attached tothe substrate 170 via a conductive bridge element 160 such as solder.

The second connection interface 110-2 of the leadframe device 190 caninclude one or more contact elements 145 (e.g., contact element 145-1,contact element 145-2, contact element 145-3, contact element 145-4) forelectrically coupling the conductive path 190 of the leadframe device190 to the substrate 170. In other words, according to one embodiment,the conductive path 140-1 can include multiple contact elements 145 forelectrically connecting the conductive path 140-1 to the substrate 170.

As shown, the contact elements 145 can be separated from each other viaelectrically non-conductive material such as a plastic filler of theleadframe package 100. The cross-hatched region indicates non-conductivematerial between the contact elements 145.

Although any reasonable configuration is possible, according to oneembodiment, the first connection interface 110-1 resides on a firstfacing 150-1 of the leadframe device 190 and the second connectivityinterface 110-2 resides on a second facing 150-2 of the leadframe device190.

By way of a non-limiting example, the first facing 150-1 and the secondfacing 150-2 of the leadframe device 190 can be disposed on oppositesides of the leadframe device 190 with respect to each other, adjacentsides of the leadframe, same side of the leadframe, etc.

One way to produce the leadframe device 190 is to start out with a slabof metal such as copper of appropriate thickness. The copper can beetched or machined to remove metal between the conductive paths 140 sothat each of the conductive paths 140 are electrically independent ofeach other. In other words, according to one embodiment, the conductivepaths 140 in leadframe device 190 are not connected to each other.

Further machining can be performed at axial ends of the conductive paths145 to fit the conductive paths 140 within the leadframe device 190.Since it may be desirable to have spaced surfaces as in FIG. 8, portionsof each of one or more of the conductive paths 140 on facing 150-2 canbe etched and filled in with a non-conductive material such as plasticso that pads or contact elements are spaced from each other. Thenon-conductive material such as plastic also can fill in between theconductive paths 140 and above and around circuit 120 so as to producepackage 100 and protect the electrical circuit from adverseenvironmental conditions.

Note that the inclusion of contact elements 145 on each of one or moreof the conductive paths 140 is shown by way of non-limiting example onlyand that a respective conductive path need include a surface in which toattach to a host substrate 170. Accordingly, the respective conductivepath can be used as a way of connecting nodes of electrical circuit 120at a layer other than in a metalization layer of an integrated circuit.In this latter embodiment, when the leadframe device 190 is attached toa host substrate 170, the respective conductive path does not attach tothe substrate.

FIG. 2 is an example 3-D diagram illustrating how an electrical circuit120 is coupled to a leadframe device 190 according to embodimentsherein.

As shown, the exposed side of electrical circuit 120 having electricalnodes 125 (e.g., electrical node 125-1, electrical node 125-2, etc.) isattached to the facing 150-1 of the leadframe device 190.

In one embodiment, the electrical circuit 120 is a planar-shaped device(such as an integrated circuit, semiconductor device, etc.) includingmultiple circuits 210 (e.g., circuit 210-1, circuit 210-2, circuit210-3, circuit 210-4, circuit 210-5, circuit 210-6) spread about asurface of the electrical circuit 120 (e.g., planar shaped device).

A size associated with leadframe device 190 and corresponding electricalcircuit 120 is highly scalable. For example, a number of rows and/orcolumns of circuits 210 residing on electrical circuit 120 can be variedto create switches having different sinking/sourcing capabilities. Insuch embodiments when the row and/or columns of circuits 210 isadjusted, the size of leadframe device 190 and number of conductivepaths 140 in the leadframe device 190 can be adjusted to match thenumber of rows and columns of circuits 210 of electrical circuit 120. Anexample of adjusting rows and columns circuits 210 is shown anddiscussed with respect to FIG. 4B.

Referring again to FIG. 2, each of the electrical circuits 210 ofcircuit 120 can have one or more inputs and/or one or more outputs thatare electrically independent of each other. For example, in oneembodiment, electrical circuit 120 is an array of switch tiles (circuits210), each of which has a respective source and drain that are notattached to sources and drains of any of the other electrical circuits210. In other words, the respective source nodes and drain nodes can beelectrically isolated from each other except for the electricalconnection provided by the conductive path in the leadframe device 190.In one embodiment, each of the conductive paths 140 is electricallyindependent until the leadframe device 190 is electrically attached to acircuit board substrate. As discussed later in this specification, thecircuit substrate (to which the leadframe device 190 is attached) caninclude further conductive paths that provide connectivity amongst theconductive paths 140 in the leadframe device 190.

In one embodiment, each of the circuits 210 is a switch circuit as willbe discussed later in this specification. Connectivity of the circuits210 with respect to the conductive paths 140 as described hereinconnects the circuits 210 in parallel. As mentioned, contact elements ofthe conductive paths (e.g., surfaces on facing 150-2 of leadframe device190 provide connectivity with respect to a substrate such as a printedcircuit board or other interconnecting device.

The conductive paths 140 (e.g., conductive path 140-1, conductive path140-2, conductive path 140-3, conductive path 140-4, etc.) can provideconnectivity between the multiple electrically independent circuits 210and, optionally, through the leadframe device 190 to the substrate 170.For example, as shown, the facing of electrical circuit 120 can bepressed or moved into communication of the facing 150-1 of the leadframedevice 190 to connect the electrical nodes 125 to correspondinglocations on the conductive paths 140.

More specifically, when electrical circuit 120 is moved intocommunication with facing 150-1, electrical node 125-2 (e.g., sourcenode S₁₁) of circuit 210-1 comes in contact with the location labeledS₁₁ on conductive path 140-1; electrical node 125-1 (e.g., source nodeS₁₂) of circuit 210-2 comes in contact with the location labeled S₁₂ onconductive path 140-1; electrical node labeled source node S₁₃ incircuit 210-3 comes in contact with the location labeled S₁₃ onconductive path 140-1; and so on. Thus, the conductive path 140-1 ofleadframe device 190 can provide “off-chip” connectivity with respect toa first set of electrical nodes in the electrical circuit 120.

In accordance with the above embodiment, when electrical circuit 120 ismoved in communication with facing 150-1, electrical node labeled drainnode D₁₁ of circuit 210-1 comes in contact with the location labeled D₁₁on conductive path 140-2; electrical node labeled drain node D₁₂ ofcircuit 210-2 comes in contact with the location labeled D₁₂ onconductive path 140-2; electrical node labeled drain node D₁₃ in circuit210-3 comes in contact with the location labeled D₁₃ on conductive path140-1; and so on. Thus, the conductive path 140-2 of leadframe device190 can be configured to provide off-chip connectivity with respect to asecond set of electrical nodes in the electrical circuit 120.

Additionally, when electrical circuit 120 is moved in communication withfacing 150-1, electrical node labeled source node S₂₁) of circuit 210-4comes in contact with the location labeled S₂₁ on conductive path 140-3;electrical node labeled source node S₂₂ in circuit 210-5 comes incontact with the location labeled S₂₂ on conductive path 140-3;electrical node labeled source node S₂₃ in circuit 210-6 comes incontact with the location labeled S₂₃ on conductive path 140-3; and soon. Thus, the conductive path 140-3 of leadframe device 190 can provide“off-chip” connectivity with respect to a third set of electrical nodesin the electrical circuit 120.

Additionally, when electrical circuit 120 is seated onto facing 150-1,electrical node labeled drain node D₂₁ of circuit 210-4 comes in contactwith the location labeled D₂₁ on conductive path 140-4; electrical nodelabeled drain node D₂₂ of circuit 210-5 comes in contact with thelocation labeled D₂₂ on conductive path 140-4; electrical node labeleddrain node D₂₃ in circuit 210-6 comes in contact with the locationlabeled D₂₃ on conductive path 140-4; and so on. Thus, the conductivepath 140-4 of leadframe device 190 can be configured to provide off-chipconnectivity with respect to a fourth set of electrical nodes in theelectrical circuit 120.

In further embodiments, it can be seen that at least a portion of eachrespective conductive path 140 in the leadframe device 190 can besubstantially orthogonal with respect to a plane of the planar-shapeddevice (e.g., electrical circuit 120) on which the multiple circuits 210reside.

FIG. 3 is an example 3-D diagram illustrating how an electrical circuit120 is coupled to a leadframe device 190 according to embodimentsherein. In this example figure, the conductive path 140-1 has beenremoved for easier viewing of conductive path 140-2 and correspondingcontact elements 345 (e.g., contact element 345-1 and contact element345-2). As shown, the contact elements 345 of the conductive path 140-2are offset with respect to the contact elements 145 of conductive path140-1. More details of the offset and pad configuration of facing 150-2are shown and discussed with respect to FIG. 8 below.

FIG. 4A is a diagram illustrating example functionality of the circuits210 residing on electrical circuit 120 according to embodiments herein.As shown, each circuit 210-1 can provide functionality such as a switchdevice.

In one embodiment, each circuit 210 includes a respective array of fieldeffect transistors in an integrated circuit that are connected inparallel to each other of to form a switch circuit tile (e.g., circuit210). As previously discussed, the switch circuit tiles each can includetwo electrical nodes (e.g., a source node and drain node) that connectto respective conductive paths 140. The common gates of circuit 210 canconnect to control driver 410.

For example, electrical circuit 120 can include a control driver 410. Inone embodiment, the control driver 410 produces a set of gate controlsignals that are used to drive the gates of each respective circuit 210.In a further example embodiment, the gate control signals are formed inone or more metalization layer of a semiconductor device on which therespective switch tiles are formed. The electrical circuit 120 caninclude metalization to provide connectivity amongst the transistorswithin an array in the tile.

FIG. 4B is an example diagram illustrating an example (silicon) wafer495 having circuits 210 according to embodiments herein. Note thatinclusion of a control driver 410 is shown by way of non-limitingexample only. The electrical circuit 120 may or may not include circuit410 or other circuits.

Embodiments herein can include fabricating multiple circuits 210 on arespective wafer 495 such as that shown in FIG. 4B. The wafer 495 can becut (e.g., sliced and diced) depending on how many of the switchcircuits 210 are desired on a respective chip being packaged in theleadframe device 190. For example, the wafer 495 can be cut to producean electrical circuit 120-1 that has nine circuits 210. The wafer 495can be cut to produce an electrical circuit 120-2 that has nine circuits210. The wafer 495 can be cut to produce an electrical circuit 120-3that has twelve circuits 210. As previously discussed, portions or allof the electrical nodes in each circuit can be independent of the nodeson the other circuits.

Of course, the leadframe device can vary in size and shape as well toaccommodate the different sized circuits 120. For applications requiringmore robust switching functionality, the package also can be adjusted insize to accommodate larger or smaller electrical circuits 120.Conversely, for applications requiring less robust switchingfunctionality, the package can be larger to accommodate largerelectrical circuits 120. As previously discussed, the leadframe device190 is highly modular and scalable based on sizing and/or spacing of:conductive paths 140, circuits 210, circuit 120, source connections anddrain connections on circuits 210, etc. In one embodiment, the sizingincludes adding/deleting rows and/or columns of a standard size ofcircuits 210 (e.g., a field effect transistor array) to produce a familyof devices having different capabilities.

FIG. 5 is an example diagram illustrating an electrical circuit 210-1according to embodiments herein. Note that each of multiple electricalcircuits 210 of circuit 120 can be configured in a similar manner ascircuit 210-1.

As shown, the example electrical circuit 210-1 can include an array oftransistors 520 such as field effect transistors. The array oftransistors 520 can include transistor 520-1, transistor 520-2,transistor 520-3, transistor 520-4, transistor 520-5, transistor 520-6,transistor 520-7, transistor 520-8, transistor 520-9, transistor 520-10,etc.

As mentioned above, the electrical circuit 210 can be one of multiplecircuits on a respective single integrated circuit substrate. Viametalization in the integrated circuit, the gate nodes, source nodes,and drain nodes of the transistors 520 can be connected to each other.

More specifically, via connectivity such as via metalization in anintegrated circuit, the source node of transistor 520-1 can be connectedto each of the source nodes of transistor 520-2, 520-3, 520-4, etc.; thesource node of transistor 520-2 can be connected to each of the sourcenodes of transistor 520-1, 520-3, 520-4, etc.; the source node oftransistor 520-3 can be connected to each of the source nodes oftransistor 520-1, 520-2, 520-4, etc.; and so on.

Via additional connectivity such as metalization in an integratedcircuit, the drain node of transistor 520-1 can be connected to each ofthe drain nodes of transistor 520-2, transistor 520-3, transistor 520-4,etc.; the drain node of transistor 520-2 can be connected to each of thedrain nodes of transistor 520-1, transistor 520-3, transistor 520-4,etc.; the drain node of transistor 520-3 can be connected to each of thedrain nodes of transistor 520-1, 520-2, 520-4, etc.; and so on. Thus, inone embodiment, the array of transistors 520 can be interconnected toform a single functional transistor circuit having a common source node(e.g., node S₁₁) and common drain node (e.g., node D₁₁). In such anembodiment, the source node of each transistor 520 can be connected tocommon node S₁₁, the drain node of each transistor 520 can be connectedto communication drain node D₁₁.

As previously discussed, each of the common drain node D₁₁ and commonsource node S₁₁ are independent of each other and (prior to packaging inleadframe device 190) may be independent of other common source nodesand common drain nodes of other electrical circuits 210. The gate nodeof each transistor 520 of circuit 210-1 can tie to a common point and becontrolled by a common gate signal. As mentioned, the gates can beconnected with each other via and interconnect such as metalization inan integrated circuit. FIG. 6 is an example diagram illustratinginterconnectivity of tiles (e.g., circuits 210) in parallel viaconductive paths 140 in the leadframe device 190 according toembodiments herein. As shown, circuit 210-1 is effectively a largetransistor having its common source node connected to conductive path140-1 and common drain node connected to conductive path 140-2; circuit210-2 is effectively a large transistor having its common source nodeconnected to conductive path 140-1 and common drain node connected toconductive path 140-2; and so on.

As previously discussed, the metal layer of electrical circuit 120 caninclude gate control signals from control driver 410 to each of thecircuits 210. Creating paths for the gate control signals can besubstantially easier according to embodiments herein because theconductive paths 140 in the leadframe device 190 provide connectivityamongst the circuits 210 in lieu of metalization in an integratedcircuit. Thus, control signals such as gate control signals or othercontrol signals can be laid out between tiles (e.g., circuits 210) andthus not interfere with the interconnectivity layer disposed over thearray of transistors in each circuit 210.

As shown, the spacing and/or widths of conductive paths can be selecteddepending on a spacing of the respective sources and drains of eachcircuit 210. For example, the spacing between conductive path 140-1 andconductive path 140-2 depends on locations of sources and drainconnections on respective circuits 210-1, 210-2, 210-3, etc. Thus, ifeach circuit 210 is designed to include a larger sized array (e.g., morerows and/or columns of transistors) or circuit 210, the spacing of theconductive paths 140-1 and conductive path 140-2 can be increased toaccount for a respective larger spacing between respective sources anddrains of circuits 210. Conversely, if the size and/or number oftransistors in the circuits 210 is reduced, the respective sourceconnections and drain connections of circuits 210 will be closertogether. In this latter case, a spacing and/or widths of conductivepaths 140-1 and 140-2 also can be adjusted or reduced to account for thechange in size of the circuits 210.

A spacing of the conductive paths 140 can be selected. In such a case,the size of circuits 210 and/or spacing of the sources and drainconnections on each circuit 210 can be adjusted to ensure that thesource and drain connections of each circuit 210 lines up with arespective conductive path 140 of leadframe device 190. Accordingly,embodiments herein include a highly scalable leadframe device 190.

As discussed herein, FIG. 6 illustrates that the conductive paths 140provide connectivity between the circuits 210 in lieu of having toprovide connectivity in one or more metalization layers of asemiconductor device. Use of the conductive paths 140 in a leadframedevice 190 provides unique current path interconnects between circuits210 (e.g., transistor array modules) to reserve a thick top layer metalin the circuit 120 such as a semiconductor device for routing of gatecontrol signals and/or other control signals between control driver 410and circuits 210. Accordingly, when circuit 120 is a semiconductordevice having multiple tiles or arrays of interconnected transistors,the conductive paths 140 provide a low impedance gate interconnectbetween tiles while a thick top metal layer of the semiconductor devicecan be used to provide connectivity between a centralized driver circuitand the multiple tiles. This simplifies a leadframe design and furtherenhances scalability.

FIG. 7 is an example diagram illustrating interconnectivity oftransistors 520 and hypothetical impedances according to embodimentsherein. As previously discussed, the transistors 520 can beinterconnected via metalization layers in an integrated circuit. By wayof a non-limiting example, the embodiment of FIG. 7 illustrates how themultiple transistors 520 can be interconnected in such a way that theimpedance paths for each transistor 520 are reasonably matched with theother transistors 520 in electrical circuit 210-1.

The impedance values A, B, C, D, E, F, G, H, I, J, K, L, M, etc.represent the impedances of conductive links (e.g., metalization layersin an integrated circuit) between each of the transistors 520. Theconnectivity within the electrical circuit (and each of the otherelectrical circuits 210) can be configured such that the total impedancepath for any transistor is within a tolerance value such as within, forexample, 20%. In other words, the legs of the paths can be within anominal value+/−10 percent.

Assume in the present example that the impedance values A, B, C, D, E,F, G, H, I, J, K, L, M, etc. represent an impedance of approximately12.5 milliohms each. Note that the value of 12.5 milliohms is shown byway of non-limiting example only. The value may be different dependingon the application.

The impedance associated with transistor 520-2 between node D₁₁ and nodeS₁₁ includes a sum of impedance D (approximately 12.5 milliohms),impedance B (approximately 12.5 milliohms), and impedance C(approximately 12.5 milliohms). Assume in this example that theimpedance between node D₁₁ and transistor 520-1 is negligible. Thus, thetotal impedance path for transistor 520-2 (not including the transistoritself) is approximately 45 milliohms.

In furtherance of this example, the impedance associated with transistor520-2 between node D₁₁ and node S₁₁ includes a sum of impedance D(approximately 12.5 milliohms), impedance B (approximately 12.5milliohms), and impedance C (approximately 12.5 milliohms). Thus, thetotal impedance path for transistor 520-2 (not including the transistoritself) is approximately 45 milliohms.

The impedance associated with transistor 520-3 between node D₁₁ and nodeS₁₁ includes a sum of impedance D (approximately 12.5 milliohms),impedance E (approximately 12.5 milliohms), and impedance C(approximately 12.5 milliohms). Thus, the total impedance path fortransistor 520-3 (not including the transistor itself) is approximately45 milliohms.

The impedance associated with transistor 520-4 between node D₁₁ and nodeS₁₁ includes a sum of impedance D (approximately 12.5 milliohms),impedance E (approximately 12.5 milliohms), and impedance F(approximately 12.5 milliohms). Assuming that the impedance between nodeS₁₁ and transistor 520-4 is negligible, the total impedance path fortransistor 520-4 (not including the transistor itself) is approximately45 milliohms.

In a similar manner, the impedance path values for each of transistors520-5, 520-6, 520-7, 520-8, etc. are each approximately equal to 45milliohms as well.

Providing balanced path impedance interconnectivity in this manner isuseful because the burden of providing isolation/coupling is moreequally shared amongst the transistors 520. Thus, no single one of groupof transistors is unduly stressed under high current sinking or sourcingconditions.

FIG. 8 is an example diagram illustrating a footprint and correspondingsurface pads of leadframe device 190 for connecting to a circuit boardsubstrate according to embodiments herein.

According to this example embodiment, only portions of the conductivepaths 140 are exposed on a respective surface of the leadframe device190. For example, contact element 145-1 and contact element 145-2(rather than a whole length of the conductive path 140-1) are exposed ona bottom surface of the leadframe device 190 for attaching to a hostsuch as printed circuit board; contact element 345-1 and contact element345-2 (rather than a whole length of the conductive path 140-2) areexposed on a bottom surface of the leadframe device 190 for attaching toa host such as printed circuit board; and so on.

The checkerboard like pattern of connection interface 150-2 reduces thelikelihood, during mounting of the leadframe device 190 to a host, suchas a printed circuit board, that a stray piece of wire, solder,conductive matter, etc. will accidentally form between the effectivepads (e.g., contact elements) of the leadframe device 190.

Note that additional pads 850 and corresponding conductive paths of theleadframe device 190 can provide connectivity with respect to theadditional circuitry of the electrical circuit 120. For example, thepads 850 can provide conductive pathways form a printed circuit board onwhich the leadframe device 190 resides and gate driver or relatedcircuitry of electrical circuit 120.

FIG. 9 is an example transparent view diagram illustratinginterconnectivity of electrical circuit 120 to corresponding traces of acircuit board via a leadframe device 190 according to embodimentsherein. As shown, traces 950 can be electrically isolated from eachother so as not to short drains to sources. Each of traces 950 can be aroute, surface pad, conductive strip, etc., on a host such as a printedcircuit board.

As previously discussed, each of circuits 210 can be configured byinterconnecting an array of field effect transistors to produce arespective field effect transistor switch circuit. Thus, as previouslydiscussed, circuit 210-1 can be a first field effect transistor switchcircuit, circuit 210-2 can be a second field effect transistor switchcircuit, circuit 210-3 can be a third field effect transistor switchcircuit, circuit 210-4 can be a fourth field effect transistor switchcircuit, circuit 210-5 can be a fifth field effect transistor switchcircuit, circuit 210-6 can be a sixth field effect transistor switchcircuit, circuit 210-7 can be a seventh field effect transistor switchcircuit, circuit 210-8 can be an eighth field effect transistor switchcircuit, and so on.

As shown, and as previously discussed, the circuits 210 of electricalcircuit 120 reside at a topmost level (e.g., connection interface 110-1)of the transparent view. At connection interface 110-1 (see also FIG.1), each circuit 210 connects to a corresponding conductive path 140beneath it. For example, source node of circuit 210-1 connects toconductive path 140-1; source node of circuit 210-2 connects toconductive path 140-1; source node of circuit 210-3 connects toconductive path 140-1; and so on. Drain node of circuit 210-1 connectsto conductive path 140-2; drain node of circuit 210-2 connects toconductive path 140-2; drain node of circuit 210-3 connects toconductive path 140-2; and so on. As previously discussed, the sourcenodes and drain nodes of each respective circuit can be electricallyisolated from each other except for respective electrical connectionsprovided by the conductive paths 140.

In a similar manner as shown, source node of circuit 210-5 connects toconductive path 140-3; source node of circuit 210-6 connects toconductive path 140-3; source node of circuit 210-7 connects toconductive path 140-3; and so on. Drain node of circuit 210-5 connectsto conductive path 140-4; drain node of circuit 210-6 connects toconductive path 140-4; drain node of circuit 210-7 connects toconductive path 140-4; and so on.

Connection interface 110-2 provides connectivity between the contactelements (cross-hatched regions of conductive paths 140) of leadframedevice 190 and the circuit board or substrate on which traces 950reside. Conductive path 140-1 includes contact elements 145-1 and 145-2for connecting to printed circuit board trace 950-1; Conductive path140-2 includes contact elements 345-1 and 345-2 for connecting toprinted circuit board trace 950-2; and so on.

In a similar manner, conductive path 140-3 includes contact elementsthat connect to printed circuit board trace 950-1. Conductive path 140-4includes contact elements that connect to printed circuit board trace950-2. Conductive path 140-5 includes contact elements that connect toprinted circuit board trace 950-1. Conductive path 140-6 includescontact elements that connect to printed circuit board trace 950-2.

Accordingly, the source nodes (as shown in FIG. 9) of the electricalcircuits 210 in package 100 get connected (via connection interface110-2) to printed circuit board trace 950-1 via conductive paths 140-1,140-3, and 140-5. The drain nodes (as shown in FIG. 9) of the electricalcircuits 210 in package 100 get connected (via connection interface110-2) to printed circuit board trace 950-2 via conductive paths 140-2,140-4, and 140-6.

Each of the conductive paths 140 can be electrically isolated from eachother until connected to a host substrate. After forming a physicalconnection between the leadframe device 190 and host as discussed above,the conductive paths 140-1, 140-3, 140-5 become electrically connectedvia trace 950-1. After forming a physical connection as discussed above,the conductive paths 140-2, 140-4, 140-6 become electrically connectedvia trace 950-2. Thus, the conductive path 140-1 and conductive path140-3 are electrically isolated from each other except for or untilelectrical coupling between the conductive path 140-1 and the conductivepath 140-3 provided by the trace 950-1 (e.g., route) in the substrate;the conductive path 140-2 and the conductive path 140-4 are electricallyisolated from each other except for electrical coupling between theconductive path 140-2 and the conductive path 140-4 provided by thetrace 950-2 (e.g., route) in the substrate; and so on.

Via application of a gate signal to the circuits 210, the switchcircuits 210 provide a low impedance path or high impedance path betweentrace 950-1 and trace 950-2. More specifically, an OFF gate signalcauses the circuits 210 to provide a high impedance path. An ON gatesignal causes the circuits to provide a low impedance path. Controlsignals for driving switch can be generated internally with respect tothe electrical circuit 120 or received off-chip via signals on the hostsubstrate that are passed up to the electrical circuit 120 viaconductive paths in the leadframe device 190. In one embodiment, adriver circuit 410 disposed on electrical circuit 120 can be configuredto generate the switch control signals based on receipt of an inputsignal. The input signal can be received by the driver circuit 410 fromthe circuit board substrate via one or more conductive path in theleadframe device 190 between the host substrate and the driver circuit.

FIG. 10 is a flowchart 1000 illustrating an example method of packagingan electrical circuit 120 in a leadframe device 190 according toembodiments herein. Note that there will be some overlap with respect toconcepts discussed above for FIGS. 1 through 9.

Step 1010 includes receiving an electrical circuit 120 such as anintegrated circuit having multiple electrically isolated switch circuitnodes disposed thereon.

Step 1020 includes receiving a leadframe device 190 in which to packagethe integrated circuit.

Step 1030 includes electrically coupling the integrated circuit to afacing 150-1 of the leadframe device 190 to provide connectivity betweenthe multiple electrically isolated switch circuit nodes of electricalcircuit 120 via at least one conductive path 140 in the leadframe device190.

FIG. 11 is an example example 3-D diagram illustrating coupling of aindependent electrical circuits 1210 to a corresponding leadframeaccording to embodiments herein.

As shown, the electrical circuit 1120 can be configured to includemultiple switch circuits that are completely independent with respect toeach other. For example, instead of being driven by a gate signalproduced on the electrical circuit 1120, each of circuits 1210-1,1210-2, 1210-3, etc. can include a gate signal that is not tied to thegate signal of other circuits 1210. Thus, each switch circuit 1210 canbe individually controlled. However, as shown in FIG. 11, the leadframedevice 1190 can include conductive paths 1140 to provide electricalconnections between the drains, gates and sources of each circuit 1210.For example, when packaged in leadframe device 1190, conductive path1140-1 electrically connects drains D11, D12, D13, etc. together;conductive path 1140-2 electrically connects gates G11, G12, G13, etc.together; conductive path 1140-3 electrically connects drains S11, S12,S13, etc. together. Thus, leadframe device 1190 can be configured toprovide connectivity between independent nodes of different circuits orprovide connectivity between multiple independent circuits.

FIG. 12 is a diagram illustrating functionality associated with anexample leadframe device 190 of a power supply system 1200 according toembodiments herein.

More specifically, a leadframe device 190 populated according toembodiments herein can be configured to include a phase controller 1240(e.g., controller logic), a control driver 410 (e.g., control driver410-1 and control driver 410-2), as well as any other conventionalcircuitry to control an output voltage applied to power load 118.

In such an embodiment, phase controller 1240 monitors the output voltage1280 and generates appropriate control signals for driving high sideswitch circuitry 1242 and low side switch circuitry 1246 in theleadframe device 190. The high side switch circuitry 1242 and low sideswitch circuitry 1246 of power supply system 1200 represent thefunctionality provided by connection of circuits 210 (on circuit 120)via conductive paths 140 to a host such as a printed circuit board asdescribed herein.

As previously discussed, additional conductive paths in the leadframedevice 190 can provide connectivity between circuit 120 and a respectiveprinted circuit board. Accordingly, any portion or functionality of apower supply system 1200 can reside in leadframe device 190 rather thanon the printed circuit board. A benefit of such a configuration is spacesavings. Typically, conventional power supplies require layout of manycomponents on a respective printed circuit board to create a powersupply. This requires considerable printed circuit board real estate andcost to assemble. In contrast to conventional techniques, inclusion ofcontrol circuitry and/or related circuitry on leadframe device 190 asdescribed herein can reduce an overall impact of populating a printedcircuit board with a power supply control system because a printedcircuit board can be populated with one or more leadframe devices ratherthan a multitude of individual components.

Again, each of the high side switch circuitry 1242 and low side switchcircuitry 1246 of leadframe device 190 can be configured in accordancewith the techniques as discussed herein with respect to FIGS. 1-11. Morespecifically, in an example embodiment, a first set of conductive paths140 in the leadframe device 190 can provide connectivity amongstmultiple circuits 210 of circuit 120 to produce high side switchcircuitry 1242; a second set of conductive paths 140 in the leadframedevice 190 can provide connectivity amongst multiple circuits 210 incircuit 120 to produce low side switch circuitry 1246; and so on. Aspreviously discussed, the leadframe device 190 includes contact elements145 for connecting the switch circuitry to a printed circuit board.

Each phase in power supply system 1200 can require a respectiveindependently operating high side switch and low side switch. Theleadframe device 190 can be configured to provide switching circuitryfor each of a number of phases. Thus, in certain embodiments, theleadframe device 190 can include a multi-phase power supply controllerand related circuitry.

In addition to including control driver 410 as discussed above in FIG.4A, note that circuit 120 can include phase controller 1240 formonitoring output voltage 1280 and producing phase control signals tocontrol respective high side switch circuitry 1242 and low side switchcircuitry 1246 for the embodiment as discussed in FIG. 12. Accordingly,the leadframe device 190 can include any suitable circuits to facilitategeneration of output voltage 180.

Additionally, note that the leadframe device 190 can be configured toinclude a conductive path from circuit 120 to communication link 1291 ona printed circuit board such that the phase controller 1240 andprocessor 1292 (also on circuit board) can communicate with each other.In one embodiment, the output voltage 180 can be used to power theprocessor 1292.

As shown in the example embodiment of FIG. 12, during operation, phasecontroller 1240 generates control signal 1241-1 to control respectivehigh side switch circuitry 1242 and control signal 1241-2 to control lowside switch circuitry 1246. When high side switch circuitry 1242 isturned ON via controller 1240 (while low side switch circuitry 1246 isOFF), the current through inductor 1244 increases via a conductive pathprovided by high side switch circuitry 1242 between voltage source 1230and inductor 1244. When low side switch circuitry 1246 is turned ON viacontroller 1240 (while high side switch circuitry 1242 is OFF), thecurrent through inductor 1244 decreases based on a conductive paththrough the low side switch circuitry 1246 between the inductor 1244 andground.

As mentioned above, based on switching of the high side switch circuitry1242 and the low side switch circuitry 1246, the leadframe device 190(e.g., a power supply control system) can regulate the output voltage1280 within a desired range for providing power to load 118.

In one embodiment, leadframe device 190 can include respective circuitryto control any number of phases present in leadframe device 190 of apower supply system 1200. Each phase can include high side switchcircuitry and low side switch circuitry as previously discussed. Todeactivate a respective phase, the phase controller 1240 can set bothhigh side switch circuitry 1242 and low side switch circuitry 1246 ofthe phase to an OFF state.

FIG. 13 is a diagram illustrating an example leadframe device 190according to embodiments herein. As shown, conductive paths 140 inleadframe device 190 provide connectivity amongst a number of transistorarrays (e.g., multiple transistors connected in parallel as discussedabove) to provide high and low side switching capability for each of oneor more phases supported by the leadframe device 190. As previouslydiscussed, the leadframe device 190 according to embodiments herein canprovide connectivity with signals on a host circuit board via conductivepaths through the leadframe device 190. In this example configuration ofFIG. 13, conductive path 1320-1, conductive path 1320-2, conductive path1320-3, conductive path 1320-4, conductive path 1320-5, etc., provideconnectivity from the circuit 120 through the leadframe device 190 to arespective circuit such as a host on which the leadframe device 190resides. Accordingly, via such connectivity, any components previouslymounted to a host circuit board can be located on the leadframe device190 instead.

As mentioned above, different families or sizes of leadframe devices canbe manufactured using different numbers of circuits 210 (e.g., switchtiles 210). For example, a number circuits included in a leadframedevice 190 can vary by adding or removing rows and/or columns of tilesof an integrated circuit that is subsequently packaged in a leadframedevice. In accordance with a first specification, embodiments hereininclude: receiving a first integrated circuit, the first integratedcircuit having a first set of electrically isolated switch circuit nodesdisposed thereon; receiving a first leadframe device in which to packagethe first integrated circuit; and electrically coupling the firstintegrated circuit to a facing of the first leadframe device to provideconnectivity between the first set of electrically isolated switchcircuit nodes on the first integrated circuit via at least oneconductive path in the first leadframe device.

In accordance with a second specification that is modified or differentwith respect to the first specification, embodiments herein include:receiving a second integrated circuit, the second integrated circuithaving a second set of electrically isolated switch circuit nodesdisposed thereon, the second integrated circuit having a differentnumber of electrically isolated switch circuit nodes than the firstintegrated circuit; receiving a second leadframe device in which topackage the second integrated circuit; and electrically coupling thesecond integrated circuit to a facing of the second leadframe device toprovide connectivity between the second set of electrically isolatedswitch circuit nodes via at least one conductive path in the secondleadframe device. Thus, a number of switch tiles can be added or removedfrom design to design to create different families of devices.

FIG. 14 is an example perspective view illustrating a die includingmultiple transistors according to embodiments herein.

As shown, die 1400 (such as a semiconductor die) includes a firsttransistor 1242 and a second transistor 1246. A surface 1450 of the die1400 (such as a flip-chip) includes multiple exposed conductive elementsG1, S1, D1, G2, S2, and D2.

The conductive elements on surface 1450 can be fabricated from anysuitable conductive material. By way of a non-limiting example, theconductive elements are fabricated from solder and facilitate mountingof nodes on the surface 1450 of die 1400 to a respective host substratesuch as a printed circuit board, lead frame device, electronic circuitpackage, etc.

The conductive elements on the surface 1450 of die 1400 are electricallycoupled to respective nodes of the first transistor 1242 and the secondtransistor 1246. For example, the exposed conductive element G1 of die1400 is electrically connected to gate region 1421 of transistor 1242disposed within die 1450; the exposed conductive element S1 of die 1400is electrically connected to source region 1423 of transistor 1242disposed within die 1400; the exposed conductive element D1 of die 1400is electrically connected to drain region 1422 of transistor 1242disposed within die 1450.

The exposed conductive element G2 of die 1400 is electrically connectedto gate region 1431 of transistor 1246 disposed within die 1450; theexposed conductive element S2 of die 1400 is electrically connected tosource region 1433 of transistor 1246 disposed within die 1400; theexposed conductive element D1 of die 1400 is electrically connected todrain region 1422 of transistor 1242 disposed within die 1450.

In one embodiment, each of the nodes (such as gate, source, drain nodes)of the transistors is electrically isolated from other nodes. As anon-limiting example, if desired, conductive element G1 can be connectedonly to gate region 1421 disposed within die 1400; conductive element D1can be connected only to drain region 1422 disposed within die 1400;conductive element S1 can be connected only to source region 1423disposed within die 1400; conductive element G2 can be connected only togate region 1431 disposed within die 1400; conductive element D2 can beconnected only to drain region 1432 disposed within die 1400; conductiveelement S2 can be connected only to source region 1433 disposed withindie 1400.

FIG. 15A is an example diagram illustrating a side view of a dieaccording to embodiments herein.

As shown, each of the conductive elements can be coupled to a respectivetransistor node via a respective conductive path disposed within the die1400. For example, conductive element D1 of transistor 1242 can beelectrically coupled to drain region 1422 (a doped region in die 1400)via a respective conductive path 1522 (fabricated from a material suchas metal); conductive element G1 can be electrically coupled to gateregion 1421 via a respective conductive path 1521 (fabricated from amaterial such as metal); conductive element S1 can be electricallycoupled to source region 1423 (a doped region in die 1400) via arespective conductive path 1523 (fabricated from a material such asmetal); and so on.

In one embodiment, the conductive elements on surface 1450 of die 1400can be sufficiently spaced apart from each other via one or moreconductive paths extending longitudinally from a respective conductiveelement to a respective doped region. The conductive elements need notbe dispose directly over a respective doped region. Transistor 1242 canbe configured in a similar manner.

FIG. 15B is an example diagram illustrating a side view of a dieaccording to embodiments herein.

As previously discussed, each of the conductive elements can be coupledto a respective transistor node via a respective conductive pathdisposed within the die 1400. In one embodiment, as shown, a respectiveconductive element can be disposed over a respective transistor region.For example, in one non-limiting embodiment, conductive element D1 canbe substantially disposed over drain region 1422; conductive element G1can be substantially disposed over gate region 1421; conductive elementS1 can be substantially disposed over source region 1423; and so on.Transistor 1246 can be configured in a similar manner such thatconductive element D2 is substantially disposed over a respective drainregion of transistor 1246; conductive element G2 is substantiallydisposed over a respective gate region of transistor 1246; conductiveelement S1 is substantially disposed over a respective source region oftransistor 1246; and so on.

FIG. 16 is an example diagram illustrating mounting of a die onto arespective host substrate according to embodiments herein.

As shown, the surface 1450 of die 1400 can be flipped and mounteddirectly or indirectly on a respective exposed facing of host substrate1600. In such an embodiment, the conductive elements of the die 1400make direct contact with respective pads (such as metallic material)disposed on host substrate 1600.

More specifically, when positioned properly, the conductive element S1contacts pad 1620-5 on the exposed surface of host substrate 1600; theconductive element G1 contacts pad 1620-6 on the exposed surface of hostsubstrate 1600; the conductive element D1 contacts pad 1620-1 on theexposed surface of host substrate 1600; the conductive element S2contacts pad 1620-4 on the exposed surface of host substrate 1600; theconductive element G2 contacts pad 1620-3 on the exposed surface of hostsubstrate 1600; the conductive element D2 contacts pad 1620-2 on theexposed surface of host substrate 1600.

The pads 1620 disposed on exposed facing of host substrate 1600 areelectrically connected to corresponding conductive elements of die 1400.For example, consistent with the power supply circuit in FIG. 12,conductive path 1610-1 in FIG. 16 (such as a trace) provides electricalconnectivity between pad 1620-1 (conductive element D1) and Vin (voltagesource 1230); conductive path 1610-2 provides electrical connectivitybetween pad 1620-2 (conductive element D2) and pad 1620-5 (conductiveelement S1) and inductor resource 1244; conductive path 1610-3 provideselectrical connectivity between pad 1620-3 (conductive element G2) anddriver DR2 in controller 1240; conductive path 1610-4 provideselectrical connectivity between pad 1620-4 and a respective groundpotential; conductive path 1610-5 provides electrical connectivitybetween pad 1620-6 (conductive element G1) and driver DR1 in controller1240.

Thus, the surface 1450 of the die 1450 and corresponding conductiveelements can be mounted directly on the host substrate 1600.

Subsequent to fabrication, via control signals 1241-1 and 1241-2, thecontroller 1240 controls a state of switches 1242 and 1246 to produceoutput voltage 1280 within a desire range.

As previously discussed, as an alternative to direct mounting, thesurface 1450 of the die 1400 can be directly coupled to an electroniccircuit package. The electronic circuit package provides connectivitybetween the respective nodes of die 1400 and the facing of the hostsubstrate.

Further as previously discussed, transistor 1242 in die 1400 can beelectrically isolated from the transistor 1246 prior to mounting of thesurface 1450 of the die 1400 to the facing of a respective hostsubstrate 1600. At least one conductive path (such as conductive path1610-2) disposed on the host substrate 1600 provides electricalconnectivity between the transistor 1242 and transistor 1246.

Note that, if desired, the die 1400 can include one or more conductivepaths extending between respective transistors. For example, in oneembodiment, the transistor 1242 (such as a control switch in a switchingpower supply) is electrically coupled to the transistor 1246 (such as asynchronous switch in a switching power supply) via a conductive pathdisposed in the die 1450.

As shown in FIG. 16, power supply circuitry disposed on host substrate1600 includes inductor element 1244. Via conductive path 1610-2, a firstnode of the inductor element 1244 is electrically connected to thesource node (conductive element S1) of transistor 1242 and the drainnode (conductive element D2) of transistor 1246. In one embodiment,controller 1240 receives feedback of output voltage 1280 produced at asecond node of the inductor element 1244. Based at least in part on thefeedback, the controller 1240 controls drivers DR1 and DR2 to drive therespective gate node G1 of transistor 1242 and the gate node G2 of thetransistor 1246 to produce the output voltage 1280 within a desiredrange.

FIG. 17 is a side view logical diagram illustrating connectivity ofnodes in a die according to embodiments herein.

As shown, by way of a non-limiting example, to create a respective powersupply circuit, drain D1 of die 1450 is electrically connected to thevoltage source 1230. As previously discussed, controller 1240 drivesgates G1 and G2. The source S1 and the drain D2 are electrically coupledto the inductor element 1244. Source S2 is connected to a ground node.

FIG. 18 is an example perspective diagram illustrating a die includingmultiple transistors and additional circuitry according to embodimentsherein.

As previously discussed, die 1400 can be used to fabricate a respectivepower supply circuit. However, note that a respective die is not limitedto including just transistors. For example, the die 1800 as shown inFIG. 18 is another example of a circuit device that can be mounted to arespective host substrate 1600. In this example, die 1800 includestransistor 1242 and transistor 1246 as well as additional circuitry suchas controller 1240. Controller 1240 can be fabricated into therespective die 1800. The nodes of controller 1240 can be electricallyisolated from transistor 1242 and transistor 1246.

In a similar manner as previously discussed, die 1800 can be flipped andmounted onto the respective host substrate 1600. Conductive paths (suchas traces) on the host substrate 1600 provide connectivity between theconductive elements 1802 (e.g., conductive element 1802-1, conductiveelement 1802-2, conductive element 1802-3, conductive element 1802-4,etc.) and respective nodes in a power supply circuit includingcontroller 1240. Accordingly, a respective die 1800 can includecontroller 1240.

Nodes such as conductive elements 1802 associated with the controller1240 fabricated in die 1800 can be electrically coupled to conductivepaths on the host substrate. The conductive paths on the host substrateprovide connectivity of the controller 1240 in die 1800 to respectivenodes (e.g., conductive elements of the transistors, voltage sources,inductor elements, etc.) in the power supply circuit.

Thus, die 1800 can be fabricated to include individual circuitcomponents such as transistors, controllers, etc. Surface 1850 of thedie 1800 can include conductive elements coupled to nodes of therespective components. Connectivity between elements in the die 1800 canoccur when the die 1800 is flipped and mounted to the respective hostsubstrate.

FIG. 19 is a flowchart 1900 illustrating an example method according toembodiments herein. Note that there will be some overlap with respect toconcepts discussed above. For example, an assembler (such asmanufacturer) installs the die 1400 on a respective host substrate tocreate a power supply circuit such as shown in FIG. 12.

In processing block 1910, the assembler receives a die such as die 1400.The die 1400 comprises: a first transistor 1242 and a second transistor1246. A surface 1450 of the die 1450 includes multiple conductiveelements (such as conductive element G1, S1, D1, G2, S2, . . . )thereon. During the fabrication process, the multiple conductiveelements on the surface 1450 are electrically coupled to respectivenodes (e.g., gate region 1421, source region 1423, drain region 1422,)of the first transistor 1242 and the second transistor 1246.

In processing block 1920, the assembler mounts a surface 1450 of the die1400 to a facing of the host substrate 1600.

Note again that techniques herein are well suited for use in packagingelectronic parts such as those that provide switching capabilities.However, it should be noted that embodiments herein are not limited touse in such applications and that the techniques discussed herein arewell suited for other applications as well.

While this invention has been particularly shown and described withreferences to preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade therein without departing from the spirit and scope of the presentapplication as defined by the appended claims. Such variations areintended to be covered by the scope of this present application. Assuch, the foregoing description of embodiments of the presentapplication is not intended to be limiting. Rather, any limitations tothe invention are presented in the following claims.

What is claimed is:
 1. An apparatus comprising: a die comprising: afirst transistor, a second transistor, and a surface including multipleconductive elements thereon, the multiple conductive elements on thesurface electrically coupled to respective nodes of the first transistorand the second transistor; and a host substrate, the surface of the diemounted on a face of the host substrate, the host substrate electricallyconnecting the first transistor and the second transistor in series;wherein the first transistor is a control switch of a switching powersupply circuit; wherein the second transistor is a synchronous switch ofthe switching power supply circuit; wherein the control switch is afirst single field effect transistor disposed in the die; wherein thesynchronous switch is a second single field effect transistor disposedin the die; and wherein the multiple conductive elements on the surfaceof the die includes: a first gate conductive element coupled to a gateregion of the first field effect transistor, a first source conductiveelement coupled to a source region of the first field effect transistor,a first drain conductive element coupled to a drain region of the firstfield effect transistor, a second gate conductive element coupled to agate region of the second field effect transistor, a second sourceconductive element coupled to a source region of the second field effecttransistor, and a second drain conductive element coupled to a drainregion of the second field effect transistor.
 2. The apparatus as inclaim 1, wherein the surface of the die is mounted directly on the hostsubstrate.
 3. The apparatus as in claim 1, wherein the surface of thedie is directly coupled to an electronic circuit package, the electroniccircuit package providing connectivity between the respective nodes andthe face of the host substrate.
 4. The apparatus as in claim 1, whereinthe first transistor is electrically isolated from the second transistorprior to mounting of the die to the face of the host substrate.
 5. Theapparatus as in claim 4, wherein at least one conductive path disposedon the host substrate provides electrical connectivity between the firsttransistor and the second transistor.
 6. The apparatus as in claim 1further comprising: an inductor element, a first node of the inductorelement electrically connected to the source region of the firsttransistor and the drain region of the second transistor; and acontroller, the controller receiving feedback of an output voltageproduced at a second node of the inductor element, the controllerdriving the gate region of the first transistor and the gate region ofthe second transistor to produce the output voltage within a desiredrange.
 7. The apparatus as in claim 6, wherein the host substrateelectrically connects an input voltage to the drain region of the firsttransistor.
 8. The apparatus as in claim 7, wherein the first transistorcomprises a first set of multiple transistor components connected inparallel; and wherein the second transistor comprises a second set ofmultiple transistor components connected in parallel.
 9. The apparatusas in claim 1, wherein the first transistor comprises a first set ofmultiple transistor components connected in parallel; and wherein thesecond transistor comprises a second set of multiple transistorcomponents connected in parallel.
 10. The apparatus as in claim 1,wherein the first transistor is electrically coupled to the secondtransistor via a conductive path disposed in the die.
 11. The apparatusas in claim 1, wherein the die includes a controller, nodes of thecontroller electrically coupled to conductive paths on the hostsubstrate; and wherein the controller is configured to controloperational states of the first transistor and the second transistor viacontrol signals transmitted over the conductive paths.
 12. The apparatusas in claim 1, wherein the first transistor is a first single lateralfield effect transistor disposed in the die; and wherein the secondtransistor is a second single lateral field effect transistor disposedin the die.
 13. The apparatus as in claim 1 further comprising: aninductor, the inductor including a first terminal and a second terminal,the first terminal of the inductor electrically coupled to theconductive path in the host substrate providing circuit connectivitybetween the source region of the first transistor and the drain regionof the second transistor, a second terminal of the inductor configuredto produce an output voltage to power a load.
 14. The apparatus as inclaim 1, wherein the host substrate provides an electrical connectionbetween the source node of the first transistor and the drain node ofthe second transistor.
 15. The apparatus as in claim 14, wherein thehost substrate electrically couples the source node of the firsttransistor and the drain node of the second transistor to an inductorcircuit of a power supply.
 16. The apparatus as in claim 1, wherein thehost substrate couples the first transistor and the second transistor inseries between a first reference voltage and a second reference voltage.17. The apparatus as in claim 1, wherein the host substrate on which thedie is mounted electrically couples the first transistor and the secondtransistor in series between a first reference voltage and a secondreference voltage; wherein the first reference voltage is electricallyconnected to the drain region of the first transistor; and wherein thesecond reference voltage is electrically connected to the source regionof the second transistor.
 18. The apparatus as in claim 1 furthercomprising: a first pad disposed on the face of the host substrate; asecond pad disposed on the face of the host substrate; and a conductivepath extending between the first pad and the second pad, the firstsource conductive element in contact with the first pad, the seconddrain conductive element in contact with the second pad.
 19. Theapparatus as in claim 18, wherein the first gate conductive element, thefirst drain conductive element, and the first source conductive elementare disposed in a first sequence on the surface of the die; wherein thesecond gate conductive element, the second drain conductive element, andthe second source conductive element are disposed in a second sequenceon the surface of the die; and wherein the first sequence is parallel tothe second sequence.
 20. A method comprising: receiving a die, the diecomprising: a first transistor, a second transistor, and a surfaceincluding multiple conductive elements thereon, the multiple conductiveelements on the surface electrically coupled to respective nodes of thefirst transistor and the second transistor; and mounting a surface ofthe die to a face of the host substrate to electrically connect thefirst transistor and the second transistor in series; wherein the firsttransistor is a control switch of a switching power supply circuit;wherein the second transistor is a synchronous switch of the switchingpower supply circuit; wherein the control switch is a first single fieldeffect transistor disposed in the die; wherein the synchronous switch isa second single field effect transistor disposed in the die; and whereinthe multiple conductive elements on the surface of the die includes: afirst gate conductive element coupled to a gate node of the first fieldeffect transistor, a first source conductive element coupled to a sourcenode of the first field effect transistor, a first drain conductiveelement coupled to a drain node of the first field effect transistor, asecond gate conductive element coupled to a gate node of the secondfield effect transistor, a second source conductive element coupled to asource node of the second field effect transistor, and a second drainconductive element coupled to a drain node of the second field effecttransistor.
 21. The method as in claim 20 further comprising: mountingthe surface of the die directly onto the host substrate.
 22. The methodas in claim 20, wherein the surface of the die is directly coupled to anelectronic circuit package, the method further comprising: mounting theelectronic circuit package to the host substrate, the electronic circuitpackage providing connectivity between the respective nodes and the faceof the host substrate.
 23. The method as in claim 20, wherein the firsttransistor is electrically isolated from the second transistor prior tomounting of the die to the face of the host substrate, the methodfurther comprising: mounting the die to the face of the host substrateto provide electrical connectivity between the first transistor and thesecond transistor via at least one conductive path disposed on the hostsubstrate.
 24. The method as in claim 20, further comprising: via afirst conductive path in the host substrate, providing an electricalconnection between a source node of the first transistor and the drainnode of the second transistor; and via a second conductive path in thehost substrate, electrically connecting an input voltage to a sourcenode of the first transistor.
 25. The method as in claim 24 furthercomprising: electrically connecting the source node of the firsttransistor and the drain node of the second transistor to a first nodeof an inductor element; and electrically connecting a controller to thegate node of the first transistor and the gate node of the secondtransistor, the controller configured to produce an output voltage at asecond node of the inductor to be within a desired range.
 26. The methodas in claim 20, wherein the die includes a controller circuit, themethod further comprising: via conductive paths in the host substrate,electrically coupling the respective nodes of the die to the controller,the controller operable to control operational states of the firsttransistor and the second transistor via control signals transmittedover the conductive paths.
 27. The method as in claim 20, whereinmounting the surface of the die to the face of the host substrateprovides an electrical connection between the source node of the firsttransistor and the drain node of the second transistor.